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Danyang deli tools co.,ltd

Products >> Diamond Wafer Blade

Diamond Wafer Blade

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Description
Product Name: Diamond Wafer Blade
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Specifications 75mm 100mm 125mm 150mm 175mm
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Diamond Wafer Blade
Out diameter 75mm 100mm 125mm 150mm 175mm
Thickness 0.15mm 0.3mm 0.4mm 0.5mm 0.63mm

Contact Us
Company: Danyang deli tools co.,ltd
Contact: Mr. XIAOMA ZHAO
Address: NO.58 GEDAN ROAD
Postcode:
Tel: 0511-86229678
Fax: 051186221720
E-mail:         


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Tel : 0511-86229678 Fax : 051186221720
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